Melbourne/San Francisco: Apple Inc’s newest smartphone models hit stores on Friday in many countries across the world, including Australia and China. The gadget giant for the first time is selling a second smartphone dubbed “5c†featuring a plastic back and bright colours. The pricier “5s†now comes in three new colors â€" gray, silver and gold.
Technology firm iFixit disassembled a gold-coloured iPhone and examined its parts. Following are some of the key components for the iPhone 5s and their makers that have been identified so far:
• Chips from Avago , Skyworks Solutions are featured in the new iPhone. Companies supplying parts for the new phone also include memory chipmaker Hynix and radio-frequency chipmaker Triquint.
• The new fingerprint sensor uses a chip from NXP Semiconductors
Apple iPhone 5s with all its components is seen in this screengrab from iFixit.
• There is no single M7 motion co-processor, a new chip that Apple said was part of the iPhone 5S when it unveiled the device last week. The M7 appears to be more a collection of chips, including chips for a gyroscope, accelerometer and compass, iFixit said.
• Broadcom’s BCM5976 chip is used for touchscreen controller.
• Murata Manufacturing Co’s 339S0205 (based on the Broadcom BCM4334) is used in Wi-Fi module.
• Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc .
Information is from iFixit, a Web site offering parts and self-repair guides for iPods and Macintosh computers. The company, which has conducted similar “tear downs†on other Apple products, posted step-by-step photos of the process on its Web site here. [1]
Reuters
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